TF01
High thermal conductivity thermal paste
  • Ultra high thermal conductivity
  • Will not separate, migrate or bleed
  • Widely applicable to different hardware components (CPU, GPU, chips…etc)
COLOR
Ultra high thermal conductivity Ultra high thermal conductivity
Ultra high thermal conductivity
Will not separate, migrate or bleed Will not separate, migrate or bleed
Will not separate, migrate or bleed
Widely applicable to different hardware components (CPU, GPU, chips…etc) Widely applicable to different hardware components (CPU, GPU, chips…etc)
Widely applicable to different hardware components (CPU, GPU, chips…etc)
Product Specifications
Model No.
SST-TF01
Color
Grey
Operating temperature
-30 ~ 280℃
Capacity
2g
Dimension
119mm x 20mm
Thermal conductivity
> 6.5 (W/m-k)
Specific Weight
> 3.25 (g/cm3)(25℃)
Temperature Resistance
-50 ~ 340℃
Accessories
Scraper
File Download
TF01 High resolution photos
File Size
2.86 MB
TF01 Product Sheet (TF01-Product_Sheet-EN.pdf)
File Size
279.23 KB